Texas Instruments (NASDAQ: TXN) announced an expansion in its portfolio of space-grade analog semiconductor products in highly reliable plastic packages for a diverse range of missions. TI developed a new device screening specification called space high-grade in plastic (SHP) for radiation-hardened products and introduced new analog-to-digital converters (ADCs) that meet the SHP qualification.
TI also introduced new product families to the radiation-tolerant Space Enhanced Plastic (Space EP) portfolio. Compared to traditional ceramic packages, plastic packages offer a smaller footprint that enables designers to reduce system-level size, weight and power, and thus help reduce launch costs.
In the past, space applications and programs used hermetically sealed, ceramic Qualified Manufacturers List (QML) Class V devices to ensure reliability. Today, applications like those in new space, designed to increase commercial access to space programs through short-term missions in low Earth orbit (LEO), are helping expand communication and connectivity.
For new space applications, there is a growing need for smaller components that help reduce system size and weight – and therefore lower the cost required to launch an application into space. Plastic substrate ball-grid array (PBGA) and plastic-encapsulated devices offer an alternative to traditional space semiconductor packages.
Space EP and SHP devices are available for purchase on TI.com and through authorized distributors. Full and custom-quantity reels are available on TI.com and through other channels. Manufacturers can select specific date and lot codes before placing their order on TI.com.
TXN shares slid $2.04, or 1.2%, to $175.03.
